Solvent -aided direct adhesion of a metal/polymer joint using micro/nano hierarchical structures

Abstract

The use of high sti ffness plastics to reduce the weight of mechanical systems has been implemented in various industrial fields. As a result, several studies to increase the adhesion strength of metal/polymer joints to improve the mechanical robustness of a system have been reported. In particular, as an alternative to existing adhesive bonding methods, research on the direct molding method has emerged. The direct molding method, which derives from the insert molding method, is based on the fabrication of microstructures on the metal surface to create mechanical interlocking. In this paper a new direct adhesion method is introduced that does not require additional heat management and instead makes use of an organic solvent. This new adhesion method was used to bond micro/nanostructured aluminum and acrylonitrile butadiene styrene (ABS) using chloroform. The bonding strength of the metal/polymer joints was tested by single -lap shear and T -peel tests. The shear strength of the Al-ABS systems showed a positive correlation with the height of the structures created on the Al roughened surfaces. The peel strength increased dramatically for the micro/nano hierarchical Al structures due to additional vertical shear interactions at the surface. Since this method does not require heat control, it im- proves the adhesion process e fficiency, as well as increases the variety of adhesion designs.