Mass production of superhydrophilic micropatterned copper surfaces using powder injection molding process

Abstract

Hydrophilic micropatterned copper surfaces are manufactured using a powder injection molding (PIM) process. Copper powder and a wax-polymer-based binder system are utilized to prepare a feedstock. The rheological properties of the feedstock are evaluated to design the PIM process. Polymethylmethacrylate (PMMA) sacrificial mold inserts fabricated by photolithography are used to shape the micropatterns. Both PIM and photolithography processes are suitable for high-volume products; therefore, the micropatterned surfaces can be mass-produced. The wettability of the manufactured surfaces is investigated by measuring the apparent contact angle. The apparent contact angle tends to decrease as the absolute value of the difference in effective surface free energy between the wet and dry states increases. When the absolute value of the difference is equal to or exceeds 150 mJ/m2, the surface is fully wetted immediately and exhibits superhydrophilicity. Both high aspect ratio and small gap size are key to achieving superhydrophilicity of the micropatterned surface.