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Design, Fabrication, and Far-Field Measurement of FOWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications
- Title
- Design, Fabrication, and Far-Field Measurement of FOWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications
- Date Issued
- 2023-06-15
- Publisher
- IMS
- ISSN
- 0149-645X
- Article Type
- Conference
- Citation
- 2023 IEEE/MTT-S International Microwave Symposium, 2023-06-15
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Related Researcher
- 송호진SONG, HO JIN
- Dept of Electrical Enginrg