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Design, Fabrication, and Far-Field Measurement of FoWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications

Title
Design, Fabrication, and Far-Field Measurement of FoWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications
Authors
HONG, WONBINLee, DongseopLee, Jae-YeongLee, KangseopKim, MinkyungKim, MyoungsunYoun, YoungnoSong, Ho-Jin
Date Issued
2023-06-15
Publisher
IMS2023
URI
https://oasis.postech.ac.kr/handle/2014.oak/119383
ISSN
0149-645X
Article Type
Conference
Citation
2023 IEEE MTT-S International Microwave Symposium, 2023-06-15
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홍원빈HONG, WONBIN
Dept of Electrical Enginrg
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