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Cited 5 time in webofscience Cited 5 time in scopus
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dc.contributor.authorHyung Woo Kim-
dc.contributor.authorSung Jea Park-
dc.contributor.authorBong-Kee Lee-
dc.contributor.authorKim, DS-
dc.date.accessioned2015-07-07T19:08:12Z-
dc.date.available2015-07-07T19:08:12Z-
dc.date.created2013-04-04-
dc.date.issued2013-03-11-
dc.identifier.issn0003-6951-
dc.identifier.other2015-OAK-0000027424en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/13119-
dc.description.abstractWe report a fabrication method of graphene nanocomposite patterns on a thermoplastic substrate using capillary filling and transfer molding techniques. As a proof of concept, we produced microheaters using a low-viscosity graphene nanocomposite solution. After filling a microchannel on a polydimethylsiloxane (PDMS) stamp with graphene solution, the solution solvent was evaporated, leaving behind the graphene nanocomposite pattern. Subsequent embossing of the graphene nanocomposite patterns on the PDMS stamp onto a polymethylmethacrylate substrate allowed the transfer of the microheater pattern. Capillary filling was characterized analytically and experimentally. The performance and thermal response of the fabricated microheater were very promising. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4795594]-
dc.description.statementofresponsibilityopenen_US
dc.languageEnglish-
dc.publisherAMER INST PHYSICS-
dc.relation.isPartOfAPPLIED PHYSICS LETTERS-
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.subjectFLOW-
dc.titleVersatile graphene nanocomposite microheater patterning for various thermoplastic substrates based on capillary filling and transfer molding-
dc.typeArticle-
dc.contributor.college기계공학과en_US
dc.identifier.doi10.1063/1.4795594-
dc.author.googleKim H.W., Park S.J., Lee B.-K., Kim D.S.en_US
dc.relation.volume102en_US
dc.relation.issue10en_US
dc.relation.startpage101907en_US
dc.contributor.id10170232en_US
dc.relation.journalAPPLIED PHYSICS LETTERSen_US
dc.relation.indexSCI급, SCOPUS 등재논문en_US
dc.relation.sciSCIen_US
dc.collections.nameJournal Papersen_US
dc.type.rimsART-
dc.identifier.bibliographicCitationAPPLIED PHYSICS LETTERS, v.102, no.10, pp.101907-
dc.identifier.wosid000316501200026-
dc.date.tcdate2019-01-01-
dc.citation.number10-
dc.citation.startPage101907-
dc.citation.titleAPPLIED PHYSICS LETTERS-
dc.citation.volume102-
dc.contributor.affiliatedAuthorKim, DS-
dc.identifier.scopusid2-s2.0-84875192103-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc3-
dc.description.scptc3*
dc.date.scptcdate2018-10-274*
dc.type.docTypeArticle-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-

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김동성KIM, DONG SUNG
Dept of Mechanical Enginrg
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