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Cited 4 time in webofscience Cited 4 time in scopus
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dc.contributor.authorJe, JH-
dc.contributor.authorYou, H-
dc.contributor.authorCullen, WG-
dc.contributor.authorMaroni, VA-
dc.contributor.authorMa, B-
dc.contributor.authorKoritala, RE-
dc.contributor.authorThieme, C-
dc.date.accessioned2016-03-31T12:58:18Z-
dc.date.available2016-03-31T12:58:18Z-
dc.date.created2009-02-28-
dc.date.issued2002-12-15-
dc.identifier.issn0921-4534-
dc.identifier.other2002-OAK-0000003022-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/18817-
dc.description.abstractWe studied the microstructure of a Pd overlayer deposited on a cube textured Ni(0 0 1) substrate using synchrotron X-ray scattering. We find the existence of an epitaxial Pd-Ni interlayer between the epitaxial Pd layer and the Ni substrate. The Pd-Ni interlayer, which is compressively strained in a manner similar to the Pd overlayer, seemingly acts to relieve the strain at the Pd/Ni interface caused by the Pd-Ni lattice mismatch. The Ni mosaic distribution of our samples is multiply spiked with a rocking angle spread of similar to16degrees, which reconciles the previously reported observation of saw tooth peaks on top of a Gaussian distribution for a similarly prepared I'd on Ni specimen. The observed sharpening of the mosaic distributions for the Pd(0 0 2) grains (full-width at half-maximum (FWHM) = 1.95degrees) and for the (0 0 2) grains of Pd-Ni interlayer (FWHM = 3.0degrees) indicates that the Pd and Pd-Ni(0 0 2) layers conform to the surface morphology instead of to the (0 0 1) crystallographic planes of Ni-substrate grains. (C) 2002 Elsevier Science B.V. All rights reserved.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE BV-
dc.relation.isPartOfPHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS-
dc.subjectPd/Ni-
dc.subjectbuffer layer-
dc.subjectbiaxial texture-
dc.subjectcube-textured Ni substrates-
dc.subjectCRITICAL-CURRENT DENSITY-
dc.subjectSUPERCONDUCTING TAPES-
dc.subjectCOATED CONDUCTORS-
dc.subjectBUFFER LAYERS-
dc.subjectGROWTH-
dc.subjectEVAPORATION-
dc.subjectDEPOSITION-
dc.subjectOXIDE-
dc.titleDetection of a Pd-Ni interlayer at the Pd/Ni interface of an epitaxial Pd film on cube textured nickel (001)-
dc.typeArticle-
dc.contributor.college신소재공학과-
dc.identifier.doi10.1016/S0921-4534(02)01325-4-
dc.author.googleJe, JH-
dc.author.googleYou, H-
dc.author.googleCullen, WG-
dc.author.googleMaroni, VA-
dc.author.googleMa, B-
dc.author.googleKoritala, RE-
dc.author.googleThieme, C-
dc.relation.volume383-
dc.relation.issue3-
dc.relation.startpage241-
dc.relation.lastpage246-
dc.contributor.id10123980-
dc.relation.journalPHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationPHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, v.383, no.3, pp.241 - 246-
dc.identifier.wosid000179363000008-
dc.date.tcdate2019-01-01-
dc.citation.endPage246-
dc.citation.number3-
dc.citation.startPage241-
dc.citation.titlePHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS-
dc.citation.volume383-
dc.contributor.affiliatedAuthorJe, JH-
dc.identifier.scopusid2-s2.0-0037114339-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc4-
dc.type.docTypeArticle-
dc.subject.keywordPlusCRITICAL-CURRENT DENSITY-
dc.subject.keywordPlusSUPERCONDUCTING TAPES-
dc.subject.keywordPlusCOATED CONDUCTORS-
dc.subject.keywordPlusBUFFER LAYERS-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusEVAPORATION-
dc.subject.keywordPlusDEPOSITION-
dc.subject.keywordPlusOXIDE-
dc.subject.keywordAuthorPd/Ni-
dc.subject.keywordAuthorbuffer layer-
dc.subject.keywordAuthorbiaxial texture-
dc.subject.keywordAuthorcube-textured Ni substrates-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-

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Dept of Materials Science & Enginrg
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