DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kong, DI | - |
dc.contributor.author | Park, CE | - |
dc.contributor.author | Hong, ST | - |
dc.contributor.author | Yang, HC | - |
dc.contributor.author | Kim, KT | - |
dc.date.accessioned | 2016-03-31T13:40:37Z | - |
dc.date.available | 2016-03-31T13:40:37Z | - |
dc.date.created | 2009-02-28 | - |
dc.date.issued | 1999-01 | - |
dc.identifier.issn | 0169-4243 | - |
dc.identifier.other | 1999-OAK-0000000821 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/20357 | - |
dc.description.abstract | The adhesion strength of and the residual stress in pyromellitic dianhydride-4,4' -oxydianiline polyimide (PMDA-ODA PI)/ gamma-APS / silicon wafer joints were investigated for various coating thicknesses of gamma-aminopropyltriethoxysilane (gamma-APS). The largest adhesion strength (780 N/m) was observed in the joint with 11 nm of gamma-APS coating thickness. The residual stress was measured by a He-Ne laser thin film stress analyzer and calculated by a finite element analysis. The residual bending stresses obtained by finite element calculations agreed very well with the experimental results. Residual stress increased with increasing gamma-APS coating thickness. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | VSP BV | - |
dc.relation.isPartOf | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.subject | finite element analysis | - |
dc.subject | gamma-APS | - |
dc.subject | peel strength | - |
dc.subject | polyimide | - |
dc.subject | residual stress | - |
dc.subject | ADHESION | - |
dc.subject | SILANE | - |
dc.title | Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer joints | - |
dc.type | Article | - |
dc.contributor.college | 화학공학과 | - |
dc.identifier.doi | 10.1163/156856199X01027 | - |
dc.author.google | Kong, DI | - |
dc.author.google | Park, CE | - |
dc.author.google | Hong, ST | - |
dc.author.google | Yang, HC | - |
dc.author.google | Kim, KT | - |
dc.relation.volume | 13 | - |
dc.relation.issue | 7 | - |
dc.relation.startpage | 805 | - |
dc.relation.lastpage | 818 | - |
dc.contributor.id | 10104044 | - |
dc.relation.journal | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.13, no.7, pp.805 - 818 | - |
dc.identifier.wosid | 000081458600005 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | 818 | - |
dc.citation.number | 7 | - |
dc.citation.startPage | 805 | - |
dc.citation.title | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 13 | - |
dc.contributor.affiliatedAuthor | Park, CE | - |
dc.contributor.affiliatedAuthor | Kim, KT | - |
dc.identifier.scopusid | 2-s2.0-0032689806 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 7 | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | finite element analysis | - |
dc.subject.keywordAuthor | gamma-APS | - |
dc.subject.keywordAuthor | peel strength | - |
dc.subject.keywordAuthor | polyimide | - |
dc.subject.keywordAuthor | residual stress | - |
dc.relation.journalWebOfScienceCategory | Engineering, Chemical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Mechanics | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Mechanics | - |
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