Morphology of organic-inorganic hybrid composites in thin films as multichip packaging material

Abstract

Silica-polyimide hybrid composites were prepared via a sol-gel process and thermal imidization. Two different types of soluble precursors, poly(amic acid) (PAA) and poly(amic diethyl ester) (ES), chemically convertible to poly(p-phenylene biphenyltetracarboximide), were used as organic polymer matrix component, and tetraethoxysilane (TEOS), convertible to silica, as the inorganic component. The structure of composites prepared as thin films was investigated by means of small-angle X-ray scattering, scanning electron microscopy and atomic force microscopy. Nanometre-scale composites were successfully obtained for less than or equal to 30 wt% TEOS-loaded mixtures with ES and PAA. It was considered from the microstructural investigation that the composite films based on ES were not significantly affected by the inorganic particles generated, maintaining the structure of the homopolyimide, while those based on PAA did not preserve the structure due to the nanoparticles grown in situ during the sol-gel process.