DYNAMIC FRACTURE-BEHAVIOR OF SIC WHISKER-REINFORCED ALUMINUM-ALLOYS
SCIE
SCOPUS
- Title
- DYNAMIC FRACTURE-BEHAVIOR OF SIC WHISKER-REINFORCED ALUMINUM-ALLOYS
- Authors
- CHANG, YW; CHO, K; DUFFY, J; LEE, S
- Date Issued
- 1991-02
- Publisher
- MINERALS METALS MATERIALS SOC
- Abstract
- This paper presents a study of dynamic fracture initiation behavior of 2124-T6 aluminum matrix composites containing 0, 5.2, and 13.2 vol pct SiC whiskers. In the experiment, an explosive charge is detonated to produce a tensile stress wave to initiate the fracture in a modified Kolsky bar (split Hopkinson bar). This stress wave loading provided a stress intensity rate, K1, of about 2 x 10(6) MPa square-root m/s. The recorded data are then analyzed to calculate the critical dynamic stress intensity factor, K(Id), of the composite, and the values obtained are compared with the corresponding quasi-static values. The test temperatures in this experiment ranged from -196-degrees-C to 100-degrees-C, within which range the fracture initiation mode was found to be mostly ductile in nature. The micromechanical processes involved in void and microcrack formation were investigated using metallographic techniques. As a general trend, experimental results show a lower toughness as the volume fraction of the SiC whisker reinforcement increases. The results also show a higher toughness under dynamic than under static loading. These results are interpreted using a simple dynamic fracture initiation model based on the basic assumption that crack extension initiates at a certain critical strain developed over some microstructurally significant distance. This model enables us to correlate tensile properties and microstructural parameters, as, for instance, the interspacing of the SiC whiskers with the plane strain fracture toughness.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/22281
- DOI
- 10.1007/BF02656805
- ISSN
- 0360-2133
- Article Type
- Article
- Citation
- METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, vol. 22, no. 2, page. 367 - 375, 1991-02
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