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Cited 33 time in webofscience Cited 48 time in scopus
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dc.contributor.authorKyoungho Lee-
dc.contributor.authorHae-Kang Jung-
dc.contributor.authorHyung-Joon Chi-
dc.contributor.authorHye-Jung Kwon-
dc.contributor.authorSim, JY-
dc.contributor.authorPark, HJ-
dc.date.accessioned2016-04-01T02:22:00Z-
dc.date.available2016-04-01T02:22:00Z-
dc.date.created2010-09-10-
dc.date.issued2010-05-
dc.identifier.issn1521-3323-
dc.identifier.other2010-OAK-0000022982-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/24996-
dc.description.abstractSerpentine microstrip lines are proposed to eliminate the far-end crosstalk in parallel high-speed interfaces by increasing the capacitive coupling ratio to equal the inductive coupling ratio. Zero far-end crosstalk voltage waveform and zero crosstalk-induced jitter (CIJ) were achieved on an FR4 printed circuit board, by adjusting the unit section length of the serpentine structure. Application of the proposed serpentine microstrip lines to the 2-drop stub series terminated logic DRAM channel increased the maximum data rate from 0.9 to 1.4 Gb/s and reduced CIJ by similar to 78 ps at 3.3 Gb/s.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherIEEE-
dc.relation.isPartOfIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.subjectCrosstalk-induced jitter-
dc.subjectfar-end crosstalk-
dc.subjectmicrostrip line-
dc.subjectVOLTAGE-
dc.subjectJITTER-
dc.titleSerpentine Microstrip Lines With Zero Far-End Crosstalk for Parallel High-Speed DRAM Interfaces-
dc.typeArticle-
dc.contributor.college전자전기공학과-
dc.identifier.doi10.1109/TADVP.2009.2033938-
dc.author.googleLee, K-
dc.author.googleJung, HK-
dc.author.googleChi, HJ-
dc.author.googleKwon, HJ-
dc.author.googleSim, JY-
dc.author.googlePark, HJ-
dc.relation.volume33-
dc.relation.issue2-
dc.relation.startpage552-
dc.relation.lastpage558-
dc.contributor.id10100874-
dc.relation.journalIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.2, pp.552 - 558-
dc.identifier.wosid000277343200029-
dc.date.tcdate2019-02-01-
dc.citation.endPage558-
dc.citation.number2-
dc.citation.startPage552-
dc.citation.titleIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.citation.volume33-
dc.contributor.affiliatedAuthorSim, JY-
dc.contributor.affiliatedAuthorPark, HJ-
dc.identifier.scopusid2-s2.0-77952011596-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc21-
dc.type.docTypeArticle-
dc.subject.keywordAuthorCrosstalk-induced jitter-
dc.subject.keywordAuthorfar-end crosstalk-
dc.subject.keywordAuthormicrostrip line-
dc.relation.journalWebOfScienceCategoryEngineering, Manufacturing-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-

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박홍준PARK, HONG JUNE
Dept of Electrical Enginrg
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