DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kyoungho Lee | - |
dc.contributor.author | Hae-Kang Jung | - |
dc.contributor.author | Hyung-Joon Chi | - |
dc.contributor.author | Hye-Jung Kwon | - |
dc.contributor.author | Sim, JY | - |
dc.contributor.author | Park, HJ | - |
dc.date.accessioned | 2016-04-01T02:22:00Z | - |
dc.date.available | 2016-04-01T02:22:00Z | - |
dc.date.created | 2010-09-10 | - |
dc.date.issued | 2010-05 | - |
dc.identifier.issn | 1521-3323 | - |
dc.identifier.other | 2010-OAK-0000022982 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/24996 | - |
dc.description.abstract | Serpentine microstrip lines are proposed to eliminate the far-end crosstalk in parallel high-speed interfaces by increasing the capacitive coupling ratio to equal the inductive coupling ratio. Zero far-end crosstalk voltage waveform and zero crosstalk-induced jitter (CIJ) were achieved on an FR4 printed circuit board, by adjusting the unit section length of the serpentine structure. Application of the proposed serpentine microstrip lines to the 2-drop stub series terminated logic DRAM channel increased the maximum data rate from 0.9 to 1.4 Gb/s and reduced CIJ by similar to 78 ps at 3.3 Gb/s. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.relation.isPartOf | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
dc.subject | Crosstalk-induced jitter | - |
dc.subject | far-end crosstalk | - |
dc.subject | microstrip line | - |
dc.subject | VOLTAGE | - |
dc.subject | JITTER | - |
dc.title | Serpentine Microstrip Lines With Zero Far-End Crosstalk for Parallel High-Speed DRAM Interfaces | - |
dc.type | Article | - |
dc.contributor.college | 전자전기공학과 | - |
dc.identifier.doi | 10.1109/TADVP.2009.2033938 | - |
dc.author.google | Lee, K | - |
dc.author.google | Jung, HK | - |
dc.author.google | Chi, HJ | - |
dc.author.google | Kwon, HJ | - |
dc.author.google | Sim, JY | - |
dc.author.google | Park, HJ | - |
dc.relation.volume | 33 | - |
dc.relation.issue | 2 | - |
dc.relation.startpage | 552 | - |
dc.relation.lastpage | 558 | - |
dc.contributor.id | 10100874 | - |
dc.relation.journal | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.2, pp.552 - 558 | - |
dc.identifier.wosid | 000277343200029 | - |
dc.date.tcdate | 2019-02-01 | - |
dc.citation.endPage | 558 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 552 | - |
dc.citation.title | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
dc.citation.volume | 33 | - |
dc.contributor.affiliatedAuthor | Sim, JY | - |
dc.contributor.affiliatedAuthor | Park, HJ | - |
dc.identifier.scopusid | 2-s2.0-77952011596 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 21 | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | Crosstalk-induced jitter | - |
dc.subject.keywordAuthor | far-end crosstalk | - |
dc.subject.keywordAuthor | microstrip line | - |
dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
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