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Cited 14 time in webofscience Cited 16 time in scopus
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dc.contributor.authorChoi, M-
dc.contributor.authorSim, JY-
dc.contributor.authorPark, HJ-
dc.contributor.authorKIM, BYUNGSUB-
dc.date.accessioned2016-04-01T07:48:05Z-
dc.date.available2016-04-01T07:48:05Z-
dc.date.created2016-02-22-
dc.date.issued2015-05-
dc.identifier.issn1549-8328-
dc.identifier.other2015-OAK-0000033079-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/26887-
dc.description.abstractThis paper presents an approximate closed-form transfer function model for diverse differential interconnects. The proposed model is simple, intuitive, and can accurately describe various interconnects satisfying the validity conditions which theoretically bound the approximation error. The proposed model also provides a conceptual circuit representation by analogy with an equivalent circuit model of a single-ended interconnect. The model's accuracy is verified by comparing calculated through-and crosstalk-transfer functions against w-element SPICE simulation results for various LC-dominant and RC-dominant interconnects. Our analysis also empirically verifies that the approximation error is bounded by the validity parameters. In addition, the computation time is improved by about 157 times compared to that of the previous numerical computation method built-in SPICE simulator. With the proposed channel model, designers can easily understand and analyze the behaviors of various differential interconnects without complex analysis.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.relation.isPartOfIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS-
dc.titleAn Approximate Closed-Form Transfer Function Model for Diverse Differential Interconnects-
dc.typeArticle-
dc.contributor.college전자전기공학과-
dc.identifier.doi10.1109/TCSI.2015.2407435-
dc.author.googleChoi, M-
dc.author.googleSim, JY-
dc.author.googlePark, HJ-
dc.author.googleKim, B-
dc.relation.volume62-
dc.relation.issue5-
dc.relation.startpage1335-
dc.relation.lastpage1344-
dc.contributor.id10100874-
dc.relation.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.62, no.5, pp.1335 - 1344-
dc.identifier.wosid000353887300014-
dc.date.tcdate2019-02-01-
dc.citation.endPage1344-
dc.citation.number5-
dc.citation.startPage1335-
dc.citation.titleIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS-
dc.citation.volume62-
dc.contributor.affiliatedAuthorSim, JY-
dc.contributor.affiliatedAuthorPark, HJ-
dc.contributor.affiliatedAuthorKIM, BYUNGSUB-
dc.identifier.scopusid2-s2.0-84928963507-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc6-
dc.description.scptc2*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle; Proceedings Paper-
dc.subject.keywordAuthorCrosstalk-
dc.subject.keywordAuthordifferential transmission line-
dc.subject.keywordAuthorinterconnect model-
dc.subject.keywordAuthoron-chip wire-
dc.subject.keywordAuthorprinted circuit board-
dc.subject.keywordAuthorsignal integrity-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-

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김병섭KIM, BYUNGSUB
Dept of Electrical Enginrg
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