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dc.contributor.authorKim, CC-
dc.contributor.authorKim, JK-
dc.contributor.authorLee, JL-
dc.contributor.authorJe, JH-
dc.contributor.authorYi, MS-
dc.contributor.authorNoh, DY-
dc.contributor.authorHwu, Y-
dc.contributor.authorRuterana, P-
dc.contributor.author김종규-
dc.date.accessioned2016-04-01T08:31:18Z-
dc.date.available2016-04-01T08:31:18Z-
dc.date.issued2001-11-
dc.identifier.citationPHYSICA STATUS SOLIDI A-APPLIED RESEARCH-
dc.identifier.citationv.188-
dc.identifier.citationno.1-
dc.identifier.citationpp.379-382-
dc.identifier.issn0031-8965-
dc.identifier.other2001-OAK-0000018770-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/28162-
dc.description.abstractWe investigated the micro-structural and electrical behavior of Ni/Au contacts on GaN(0001) during annealing in N-2 and in air. The formation of a Ni4N phase deteriorates the contact resistivity if annealed in N2. Annealing in air, however, dramatically improves it. The oxidation, by creating, them more energy favorable Ni-O bonds, seems to be the recipe to successfully suppress the formation of Ni4N which otherwise would be enhanced significantly by the presence of Au as a catalyst.-
dc.description.statementofresponsibilityX-
dc.publisherWILEY-V C H VERLAG GMBH-
dc.subjectP-TYPE GAN-
dc.subjectFIELD-EFFECT TRANSISTORS-
dc.subjectDIODES-
dc.titleAu catalyzed structural and electrical evolution of Ni/Au contact to GaN-
dc.typeConference-
dc.contributor.college신소재공학과-
dc.author.googleKim, CC-
dc.author.googleKim, JK-
dc.author.googleLee, JL-
dc.author.googleJe, JH-
dc.author.googleYi, MS-
dc.author.googleNoh, DY-
dc.author.googleHwu, Y-
dc.author.googleRuterana, P-
dc.relation.volume188-
dc.relation.issue1-
dc.relation.startpage379-
dc.relation.lastpage382-
dc.contributor.id10100864-
dc.publisher.locationGE-
dc.relation.journalPHYSICA STATUS SOLIDI A-APPLIED RESEARCH-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCIE-
dc.collections.nameConference Papers-
dc.type.docTypeProceedings Paper-

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