Overcoming of nanoscale adhesion by electrostatic induction
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- Title
- Overcoming of nanoscale adhesion by electrostatic induction
- Authors
- Kim, D; Park, HC; Lee, KH; Park, KB; Choi, K; Hwang, W
- Date Issued
- 2009-05
- Publisher
- ELSEVIER SCIENCE BV
- Abstract
- Polymeric nanopillar array was replicated by dipping of anodic aluminum oxide template into amorphous fluoropolymer (Teflon (R): DuPont (TM)) solution. The prepared anodic aluminum oxide template has the self-ordered nanohole structures with the high-aspect-ratio (more than 100). To obtain Teflon nanopillar array, Teflon replication based on the dipping method was used, with a 6 wt% Teflon solution. During the replication, the adhesion problem by the van der Waals interaction at micro/nanoscale was overcome by electrostatic induction. (C) 2008 Elsevier B.V. All rights reserved.
- Keywords
- Nanopillar; Anodic aluminum oxide; Van der Waals interaction; Electrostatic induction; ANODIC ALUMINUM-OXIDE; NANOSTRUCTURED SURFACES; NANOPILLAR ARRAYS; STAMP DEFORMATION; FABRICATION; TEMPLATE; CARBON; REPLICATION; FILMS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/28401
- DOI
- 10.1016/j.cap.2008.06.017
- ISSN
- 1567-1739
- Article Type
- Article
- Citation
- CURRENT APPLIED PHYSICS, vol. 9, no. 3, page. 703 - 706, 2009-05
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- There are no files associated with this item.
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