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Cited 3 time in webofscience Cited 3 time in scopus
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dc.contributor.authorCHUNG, CH-
dc.contributor.authorMOON, SH-
dc.contributor.authorRHEE, SW-
dc.date.accessioned2016-04-01T09:00:27Z-
dc.date.available2016-04-01T09:00:27Z-
dc.date.created2009-03-16-
dc.date.issued1995-11-
dc.identifier.issn0734-2101-
dc.identifier.other1995-OAK-0000011127-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/29248-
dc.description.abstractrole of surface hydrides and fluorides in the Si chemical vapor deposition (CVD) process was studied by in situ Fourier transform infrared spectroscopy using a porous silicon film as the substrate, Hydrides protect the silicon surface from oxidation until they are desorbed at 350-400 degrees C. However, the hydrides are replaced almost completely by surface fluorides when SiH2F2 is used as a reactant in the CVD process at temperatures above 400 degrees C. The surface is then etched due to a reaction between the fluorides and the surface silicon, When the process temperature is lowered to 250 degrees C, the surface is covered by both hydrides and fluorides, and a silicon film is deposited. (C) 1995 American Vacuum Society.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherAMER INST PHYSICS-
dc.relation.isPartOfJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS-
dc.subjectLOW-TEMPERATURE-
dc.subjectEPITAXIAL-GROWTH-
dc.subjectPOROUS SILICON-
dc.subjectFILMS-
dc.subjectHYDROGEN-
dc.subjectWATER-
dc.subjectSIH4-
dc.titleIN-SITU INFRARED SPECTROSCOPIC STUDY ON THE ROLE OF SURFACE HYDRIDES AND FLUORIDES IN THE SILICON CHEMICAL-VAPOR-DEPOSITION PROCESS-
dc.typeArticle-
dc.contributor.college화학공학과-
dc.identifier.doi10.1116/1.579470-
dc.author.googleCHUNG, CH-
dc.author.googleMOON, SH-
dc.author.googleRHEE, SW-
dc.relation.volume13-
dc.relation.issue6-
dc.relation.startpage2698-
dc.relation.lastpage2702-
dc.contributor.id10052631-
dc.relation.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.13, no.6, pp.2698 - 2702-
dc.identifier.wosidA1995TF11100007-
dc.date.tcdate2019-02-01-
dc.citation.endPage2702-
dc.citation.number6-
dc.citation.startPage2698-
dc.citation.titleJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS-
dc.citation.volume13-
dc.contributor.affiliatedAuthorRHEE, SW-
dc.identifier.scopusid2-s2.0-21844498955-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc2-
dc.type.docTypeArticle-
dc.subject.keywordPlusLOW-TEMPERATURE-
dc.subject.keywordPlusEPITAXIAL-GROWTH-
dc.subject.keywordPlusPOROUS SILICON-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusHYDROGEN-
dc.subject.keywordPlusWATER-
dc.subject.keywordPlusSIH4-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-

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