24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios
SCIE
SCOPUS
- Title
- 24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios
- Authors
- Hong, W; Goudelev, A; Baek, KH; Arkhipenkov, V; Lee, J
- Date Issued
- 2011-07
- Publisher
- IEEE
- Abstract
- An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 x 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 x 15 x 1.02 mm(3) in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45 degrees beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/36558
- DOI
- 10.1109/LAWP.2011.2162640
- ISSN
- 1536-1225
- Article Type
- Article
- Citation
- IEEE Antennas and Wireless Propagation Letters, vol. 10, page. 738 - 741, 2011-07
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