Atomic-scale quantification of interdiffusion and dopant localization in GeSbTe-based memory devices

Abstract

Fabrication of phase-change memory devices at modest or ambient temperatures leads to nanoscale compositional variations in phase-transition layers, where amorphous-polycrystalline phase change takes place via electrical switching, and can alter the device's performances. Here, by transmission electron microscopy and atom probe tomography, we address that thermal annealing at 400 degrees C for 20 min induces an elemental interdiffusion in the devices consisting of TiN (top electrode), carbon-doped GeSbTe (phase-transition layer), and TiSiN (bottom heater). With respect to the employed annealing process, the Ge atoms of GeSbTe layer have diffused into TiSiN layer at a given sample volume, while the Ti atoms of TiSiN layer into GeSbTe layer. Furthermore, non-random nature of dopant distribution in the GeSbTe materials leads to a Ti-localization including dopants at the GeSbTe/TiSiN interfaces. Our findings have two important implications: First, the annealing-driven interdiffusion of Ge and Ti is a predominant mechanism responsible for nanoscale compositional variations in GeSbTe layer; second, such an interdiffusion and the resultant dopant localization play a crucial role on the driving force for amorphous-polycrystalline transition of GeSbTe-based memory devices. Published by AIP Publishing.