DC Field | Value | Language |
---|---|---|
dc.contributor.author | Takuro Tajima | - |
dc.contributor.author | Ho-Jin Song | - |
dc.contributor.author | Hideaki Matsuzaki | - |
dc.contributor.author | Makoto Yaita | - |
dc.date.accessioned | 2018-01-04T10:36:38Z | - |
dc.date.available | 2018-01-04T10:36:38Z | - |
dc.date.created | 2017-05-16 | - |
dc.date.issued | 2017-05 | - |
dc.identifier.issn | 1531-1309 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/39151 | - |
dc.description.abstract | We present a compact terahertz antenna-in-package solution using a substrate integrated waveguide (SIW), which connects an integrated circuit (IC) to an SIW antenna. To suppress the leakage of electromagnetic waves due to bending a low-temperature cofired ceramic (LTCC) substrate, an H-plane bend SIW in the LTCC was investigated using the E-plane splitblock technology. We introduced an IC with a CPW-to-waveguide transition into the hollow SIW. The insertion loss, estimated by measuring a back-to-back transition with the H-plane-bend SIW, is 1.6 dB at 300 GHz, and 49-GHz bandwidth with less than 10-dB return loss is achieved. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.relation.isPartOf | IEEE Microwave and Wireless Components Letters | - |
dc.title | LTCC-Integrated H -Plane Bends for THz Antenna-in-Package Solution | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/LMWC.2017.2690865 | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | IEEE Microwave and Wireless Components Letters, v.27, no.5, pp.440 - 442 | - |
dc.identifier.wosid | 000401078400006 | - |
dc.date.tcdate | 2019-02-01 | - |
dc.citation.endPage | 442 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 440 | - |
dc.citation.title | IEEE Microwave and Wireless Components Letters | - |
dc.citation.volume | 27 | - |
dc.contributor.affiliatedAuthor | Ho-Jin Song | - |
dc.identifier.scopusid | 2-s2.0-85018635316 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 1 | - |
dc.description.scptc | 0 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.description.isOpenAccess | N | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | Low-temperature cofired ceramic (LTCC) | - |
dc.subject.keywordAuthor | packaging | - |
dc.subject.keywordAuthor | substrate integrated waveguide | - |
dc.subject.keywordAuthor | terahertz | - |
dc.subject.keywordAuthor | waveguide transitions | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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