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Conference
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dc.contributor.author유승주-
dc.contributor.author김동기-
dc.contributor.author이승구-
dc.contributor.author안정호-
dc.contributor.author정현욱-
dc.date.accessioned2018-06-17T10:22:43Z-
dc.date.available2018-06-17T10:22:43Z-
dc.date.created2011-03-28-
dc.date.issued2011-03-10-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/57398-
dc.publisherIEEE-
dc.relation.isPartOfDesign Automation and Test in Europe-
dc.relation.isPartOfPROC. DESIGN AUTOMATION AND TEST IN EUROPE-
dc.titleA Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded Systems-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitationDesign Automation and Test in Europe-
dc.citation.conferencePlaceFR-
dc.citation.titleDesign Automation and Test in Europe-
dc.contributor.affiliatedAuthor유승주-
dc.description.journalClass1-
dc.description.journalClass1-

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유승주YOO, SUNGJOO
Dept of Electrical Enginrg
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