Novel Flexible Lamination Encapsulation Method for Flexible Devices
- Title
- Novel Flexible Lamination Encapsulation Method for Flexible Devices
- Authors
- 이태우; 박민호
- Date Issued
- 2013-05-15
- Publisher
- IC-ME&D
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/64793
- Article Type
- Conference
- Citation
- The 24th International Conference Molecular Electronics & Devices, 2013-05-15
- Files in This Item:
- There are no files associated with this item.
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