Lamination Encapsulation Method for Flexible Device
- Title
- Lamination Encapsulation Method for Flexible Device
- Authors
- 이태우; 박민호; 김진유
- Date Issued
- 2013-11-13
- Publisher
- ACOE
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/64822
- Article Type
- Conference
- Citation
- 5th Asian Conference on Organic Electronics, 2013-11-13
- Files in This Item:
- There are no files associated with this item.
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