Conference
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Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이정수 | - |
| dc.date.accessioned | 2018-06-19T05:03:05Z | - |
| dc.date.available | 2018-06-19T05:03:05Z | - |
| dc.date.created | 2016-12-20 | - |
| dc.date.issued | 2016-10-26 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/72358 | - |
| dc.publisher | 한국반도체디스플레이기술학회 | - |
| dc.relation.isPartOf | 2016 반도체디스플레이 심포지움 및 추계학술대회 | - |
| dc.title | Void-free bottom-up electroplating for fabrication of through-silicon via | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | 2016 반도체디스플레이 심포지움 및 추계학술대회 | - |
| dc.citation.conferenceDate | 2016-10-26 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2016 반도체디스플레이 심포지움 및 추계학술대회 | - |
| dc.contributor.affiliatedAuthor | 이정수 | - |
| dc.description.journalClass | 2 | - |
| dc.description.journalClass | 2 | - |
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Related Researcher
- 이정수LEE, JEONG SOO
- Dept of Electrical Enginrg