THIN SOLID FILMS, vol. 517, no. 8, page. 2563 - 2580, 2009-02-27
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, vol. 24, no. 5, page. 2276 - 2281, 2006-09
APPLIED PHYSICS LETTERS, vol. 91, no. 9, 2007-08-27
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, vol. 46, no. 5B, page. 3224 - 3228, 2007-05
LANGMUIR, vol. 24, no. 24, page. 14296 - 14305, 2008-12-16
MICROELECTRONIC ENGINEERING, vol. 84, no. 12, page. 2865 - 2868, 2007-12
THIN SOLID FILMS, vol. 516, no. 21, page. 7345 - 7349, 2008-09-01
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THIN SOLID FILMS, vol. 517, no. 14, page. 3892 - 3895, 2009-05-29
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MICROELECTRONIC ENGINEERING, vol. 85, no. 1, page. 39 - 44, 2008-01
ELECTROCHEMICAL AND SOLID STATE LETTERS, vol. 9, no. 6, page. G191 - G194, 2006-01