Full metadata record
DC Field | Value | Language |
dc.contributor.author | SONG, HO JIN | - |
dc.date.accessioned | 2020-04-10T06:03:39Z | - |
dc.date.available | 2020-04-10T06:03:39Z | - |
dc.date.created | 2020-04-09 | - |
dc.date.issued | 2019-06-02 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/103017 | - |
dc.publisher | IEEE | - |
dc.relation.isPartOf | 2019 IEEE MTT International Microwave Symposium (IMS) | - |
dc.relation.isPartOf | 2019 IEEE MTT International Microwave Symposium (IMS) | - |
dc.title | Preliminary Observation on Wafer-Level Terahertz Packaging and Heterogeneous Integration | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.identifier.bibliographicCitation | 2019 IEEE MTT International Microwave Symposium (IMS) | - |
dc.citation.conferenceDate | 2019-06-02 | - |
dc.citation.conferencePlace | US | - |
dc.citation.title | 2019 IEEE MTT International Microwave Symposium (IMS) | - |
dc.contributor.affiliatedAuthor | SONG, HO JIN | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
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