Preliminary Observation on Wafer-Level Terahertz Packaging and Heterogeneous Integration
- Title
- Preliminary Observation on Wafer-Level Terahertz Packaging and Heterogeneous Integration
- Authors
- SONG, HO JIN
- Date Issued
- 2019-06-02
- Publisher
- IEEE
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/103017
- Article Type
- Conference
- Citation
- 2019 IEEE MTT International Microwave Symposium (IMS), 2019-06-02
- Files in This Item:
- There are no files associated with this item.
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