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Studies on the Thermal Stability and Degradation Kinetics of Pd/PC Nanocomposites SCIE SCOPUS

Title
Studies on the Thermal Stability and Degradation Kinetics of Pd/PC Nanocomposites
Authors
Onbattuvelli, VPRochefort, WESimonsen, JPark, SJGerman, RMAtre, SV
Date Issued
2010-12-15
Publisher
JOHN WILEY & SONS INC
Abstract
Effect of heating rate, Pd content, and synthesis method on the thermal stability of the ex situ and in situ Palladium/polycarbonate (Pd/PC) nanocomposites was investigated. TEM images revealed discrete Pd nanoclusters of about 5 and 15 rim sizes for 1 and 2 vol % ex situ nanocomposites, respectively. However, agglomerated Pd nanoclusters were noticed in the in situ samples, irrespective of the Pd content. The ex situ Pd/PC nanocomposites showed high onset temperature (Ti) for thermal degradation of PC than the in situ and pure PC samples. Pd content and heating rates were found to have a positive influence on the Ti and Tin (temperature at the maximum degradation rate occurs) of the Pd/PC nanocomposites. Thermal degradation of the PC was found to follow the first-order kinetics in the Pd/PC nanocomposites. The activation energies associated with the degradation were determined by using the Kissinger method. These activation energies are used to construct the Master decomposition curve (MDC) and weight-time-temperature (alpha-t-T) plots that describe the time-temperature dependence of the PC pyrolysis in the Pd/PC nanocomposites. These constructed alpha-t-T plots were validated with the data from isothermal measurements. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 118: 3602-3611,2010
Keywords
palladium/polycarbonate nanocomposites; activation energy; degradation kinetics; GOLD NANOPARTICLES; PALLADIUM; POLYANILINE; DECOMPOSITION; MICROSCOPY; SILVER; CURVE
URI
https://oasis.postech.ac.kr/handle/2014.oak/25547
DOI
10.1002/app.32403
ISSN
0021-8995
Article Type
Article
Citation
JOURNAL OF APPLIED POLYMER SCIENCE, vol. 118, no. 6, page. 3602 - 3611, 2010-12-15
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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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