LTCC-Integrated H -Plane Bends for THz Antenna-in-Package Solution
SCIE
SCOPUS
- Title
- LTCC-Integrated H -Plane Bends for THz Antenna-in-Package Solution
- Authors
- Takuro Tajima; Ho-Jin Song; Hideaki Matsuzaki; Makoto Yaita
- Date Issued
- 2017-05
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Abstract
- We present a compact terahertz antenna-in-package solution using a substrate integrated waveguide (SIW), which connects an integrated circuit (IC) to an SIW antenna. To suppress the leakage of electromagnetic waves due to bending a low-temperature cofired ceramic (LTCC) substrate, an H-plane bend SIW in the LTCC was investigated using the E-plane splitblock technology. We introduced an IC with a CPW-to-waveguide transition into the hollow SIW. The insertion loss, estimated by measuring a back-to-back transition with the H-plane-bend SIW, is 1.6 dB at 300 GHz, and 49-GHz bandwidth with less than 10-dB return loss is achieved.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/39151
- DOI
- 10.1109/LMWC.2017.2690865
- ISSN
- 1531-1309
- Article Type
- Article
- Citation
- IEEE Microwave and Wireless Components Letters, vol. 27, no. 5, page. 440 - 442, 2017-05
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.