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Void-free bottom-up electroplating for fabrication of through-silicon via
- Title
- Void-free bottom-up electroplating for fabrication of through-silicon via
- Authors
- 이정수
- Date Issued
- 2016-10-26
- Publisher
- 한국반도체디스플레이기술학회
- Article Type
- Conference
- Citation
- 2016 반도체디스플레이 심포지움 및 추계학술대회, 2016-10-26
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Related Researcher
- 이정수LEE, JEONG SOO
- Dept of Electrical Enginrg