Conference
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 권태헌 | - |
| dc.date.accessioned | 2018-06-23T12:12:00Z | - |
| dc.date.available | 2018-06-23T12:12:00Z | - |
| dc.date.created | 2009-03-27 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/89380 | - |
| dc.publisher | invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05) | - |
| dc.relation.isPartOf | invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05) | - |
| dc.relation.isPartOf | invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05) | - |
| dc.title | Numerical analysis of hot embossing filling stage | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05) | - |
| dc.citation.conferenceDate | 2005-07-17 | - |
| dc.citation.conferencePlace | AT | - |
| dc.citation.title | invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05) | - |
| dc.contributor.affiliatedAuthor | 권태헌 | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
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- 권태헌KWON, TAI HUN
- Div of Integrative Biosci & Biotech