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Numerical analysis of hot embossing filling stage
- Title
- Numerical analysis of hot embossing filling stage
- Authors
- 권태헌
- Publisher
- invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05)
- Article Type
- Conference
- Citation
- invited talk, the 3rd Australian-Korean Joint Rheology Conference (AKRC05)
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Related Researcher
- 권태헌KWON, TAI HUN
- Div of Integrative Biosci & Biotech